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Our various experiences and accumulated technology make it possible to design and assemble customized products according to customers requirements.
Optical related technology have been accumulated from our IC assembly core technologies.
We already produced miniature, low profile and light weight package for optical sensor application. Flip-chip and passive devices mounted products are also produced.
We provide turn-key service with advanced technologies of substrate design, assembly and function test, and we will further pursue advanced products.

Clear mold package

[Function] [Example of application]
*Photo diode  DVD recorder

*Photo electronic sensor Non-contact switch

*Color sensor Camera/printer

*Ambient sensor Mobile device/TV 

*Proximity sensor Mobile device 

*Compound sensor Mobile device

Open/Cavity sensor package

[Function]  [Example of application] 
*Photo diode  Blu-ray recorder, etc

*Image sensor Camera 

*AF sensor Camera

*MEMS Various sensors

Flip-chip package

[Function]  [Example of application] 縲・/td>
*Image sensor Camera

*AF sensor Camera

*MEMS Various sensors  

Inquiries about our products
Sales at head office 455-1, Kohzai Minamimachi, Takamatsu, Kagawa, 761-8014 Japan
TEL(087)882-1131 FAX(087)881-5575
Sales at Tokyo office 5F, Shinagawa Grand Central Tower, 2-16-4 Konan, Minato-ku, Tokyo, 108-0075 Japan
TEL (03)4221-1112 FAX (03)4221-1112

head office/Takamatsu Plant 455-1, Kohzai Minamimachi, Takamatsu, Kagawa, 761-8014 Japan TEL (087)882-1131 FAX (087)881-5575
Kanonji Plant 262 Yoshiokacho, Kanonji, KAGAWA, 768-0021, Japan TEL (0875)25-5555 FAX (0875)23-0020
Tokyo Office 5F,Shinagawa Grand Central Tower, 2-16-4 Konan,Minato-ku,
Tokyo, 108-0075 Japan
TEL (03)4221-1112 FAX (03)4221-1113