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New arrival technology FOLP Technology®

Product and technical information
Product information
 
Integrated circuits Module Thickfilm thermal printheads Chipnetwork resistors MEMS Device
 
Technical information
 
Measurement technology
Lineup of our tester
Analysis technology
Primary analysis equipment
 
New arrival technical information
 
Introduction of in-house
developed technical information
 
FOLP®
 

Structure

Cross Section Outer view
 

ROADMAP

 
 

FOLP FEATURES

 

One stop solution : AOI-ELECTRONICS Group.
Short cycle time:
Horizontal specialization Process
*Wafer Bumping /OUME-ELECTRONICS
*Substrate(RDL) Process/AOI-ELECTRONICS ASAHIMACHI PLANT
*Assembly +TEST/T&R Process/AOI-ELECTRONICS TAKAMATSU PLANT
 
Short cycle time:
     AOI use the Low Dk/Df substrate materials for RF 5G devices.
High Yield:
     KGD +KG Substrate Combination
High reliability :
     -modified Epoxy resin
     -Solder materials of various composition attach
Low Cost:
     -No use PI system
     -In a batch-molding method without Cu-pillar capillary underfil
     -Adopting the mechanical de-bonding system
 
                                    

Size Data:2MB

head office/Takamatsu Plant 455-1, Kohzai Minamimachi, Takamatsu, Kagawa, 761-8014 Japan TEL 81-87-882-1131 FAX 81-87-881-5575
Kanonji Plant 262 Yoshiokacho, Kanonji, KAGAWA, 768-0021, Japan TEL 81-875-25-5555 FAX 81-875-23-0020
Tokyo Office 5F,Shinagawa Grand Central Tower, 2-16-4 Konan,Minato-ku,
Tokyo, 108-0075 Japan
TEL 81-3-4221-1112 FAX 81-3-4221-1113
Asahimachi Plant 3-5-14,Asahimachi,Takamatsu,Kagawa,760-0065 Japan TEL 81-87-851-2002 FAX 81-87-823-6234
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