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New arrival technology FOLP Technology®

Product and technical information
Product information
 
Semiconductor package Thickfilm thermal printheads MEMS Device
 
 
FOLP®
 

Structure

Cross Section Outer view
 

ROADMAP

 
 

FOLP FEATURES

 

One stop solution : AOI-ELECTRONICS Group.
Short cycle time:
Horizontal specialization Process
*Wafer Bumping /OUME-ELECTRONICS
*Substrate(RDL) Process/AOI-ELECTRONICS ASAHIMACHI PLANT
*Assembly +TEST/T&R Process/AOI-ELECTRONICS TAKAMATSU PLANT
 
Short cycle time:
     AOI use the Low Dk/Df substrate materials for RF 5G devices.
High Yield:
     KGD +KG Substrate Combination
High reliability :
     -modified Epoxy resin
     -Solder materials of various composition attach
Low Cost:
     -No use PI system
     -In a batch-molding method without Cu-pillar capillary underfil
     -Adopting the mechanical de-bonding system
 
                                    

Size Data:2MB

head office/Takamatsu Plant 455-1, Kohzai Minamimachi, Takamatsu, Kagawa, 761-8014 Japan TEL 81-87-882-1131 FAX 81-87-881-5575
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