What’s New

2024.03.09

AOI technical article about power module packaging to publish on IMAPS Advancing Microelectronics Magazine 2024 Volume 51

2023.11.08

Updated financial information.

2023.10.25

AOI will attend the exhibition APCS2023 / SEMICON JAPAN at TOKYO BIG SIGHT on 13-15 December 2023.

2023.03.13

APEC2023：Applied Power Electronics Conference 2023.March 19-23,2023　Florida Orlando, Orange Country Convention Center

2023.03.13

19th iMAPS：International Microelectronics Assembly ＆ Packaging Society.March 13-16,2023　Arizona Fountain Hills,We-Ko-Pa Resert ＆Conference Center.

2023.02.14

Updated financial information.

2022.11.21

Updated financial information.

2022.09.29

AOI will exhibit at APCS/SEMICON JAPAN (Dec.14-16 2022 TOKYO BIGSIGHT).

2022.08.09

Updated financial information.

2022.06.28

Updated Corporate information.

2022.06.03

Updated financial information.

2022.05.24

Updated financial information.

2022.01.28

Updated financial information.

2021.10.29

Updated financial information.

2021.09.10

AOI ELECTRONICS Group technical website has been opened.(Ex.Technology: FOLP®, Flip Chip QFN, Power, WLP)

2021.07.30

Updated financial information.

2021.06.08

AOI ELECTRONICS Group technical website has been pre-opened.(Ex.Technology: FOLP®, Flip Chip QFN, Power, WLP)

2021.05.31

AOI will exhibit at ECTC 2021.(June 1,2021 – July 4,2021)

2021.05.26

Updated financial information.

2021.02.22

Updated financial information.