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EM Noise Shielding Package |
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Shield package structure drawing
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| Internal Structure of EM Noise Shielding Package |
Cross-section of EM Noise Shielding Package |
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Features
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Downsizing
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| ・To allow downsizing compared to conventional metal plate shielding, since there is no need to put mounting pad |
| for metal case connecting. |
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Low-profile
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| ・To provide low-profile package by using thinner electroforming substrate (acceptable from Typ 0.30mm). |
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Noise Reduction
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| ・To realize higher EMI shield effect by forming shield metal film on the upper surface and four sides of package. |
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Design Flexibility
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| ・To allow flexible package design because of independent terminal array pattern forming. |
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Application
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・Smartphones, Cellular phones, Tablet
Terminals, Wearable Products
・PC, DSC, Game Consoles,
Household Appliances, Health Care Products
・Satellite
Communication Equipments, Radio Devices(Radar, Aerials,
etc.) |
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Size Data：80KB
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| head office/Takamatsu Plant |
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455-1, Kohzai Minamimachi, Takamatsu, Kagawa, 761-8014 Japan |
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TEL 81-87-882-1131 |
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FAX 81-87-881-5575 |
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| Kanonji Plant |
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262 Yoshiokacho, Kanonji, KAGAWA, 768-0021, Japan |
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TEL 81-875-25-5555 |
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FAX 81-875-23-0020 |
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| Tokyo Office |
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5F,Shinagawa Grand Central Tower, 2-16-4 Konan,Minato-ku,
Tokyo, 108-0075 Japan |
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TEL 81-3-4221-1112 |
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FAX 81-3-4221-1113 |
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| Asahimachi Plant |
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3-5-14,Asahimachi,Takamatsu,Kagawa,760-0065 Japan |
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TEL 81-87-851-2002 |
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FAX 81-87-823-6234 |
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| © 2002 AOI ELECTRONICS CO.,LTD. |
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