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New arrival technology FOLP Technology®
Product and technical information
Product information
 
Semiconductor package Thickfilm thermal printheads MEMS Device
 
 
FOLP®
 

Structure
Cross Section Outer view
 

ROADMAP
 
 

FOLP FEATURES
 

One stop solution : AOI-ELECTRONICS Group.
Short cycle time:
Horizontal specialization Process
*Wafer Bumping /OUME-ELECTRONICS
*Substrate(RDL) Process/AOI-ELECTRONICS ASAHIMACHI PLANT
*Assembly +TEST/T＆R Process/AOI-ELECTRONICS TAKAMATSU PLANT
 
Short cycle time:
     AOI use the Low Dk/Df substrate materials for RF 5G devices.
High Yield:
     KGD +KG Substrate Combination
High reliability :
     -modified Epoxy resin
     -Solder materials of various composition attach
Low Cost:
     -No use PI system
     -In a batch-molding method without Cu-pillar capillary underfil
     -Adopting the mechanical de-bonding system
 
　 　 　　　　　　　　　 　　　　　　　　　　 　　　　　　　　　　　

Size Data：2MB
head office/Takamatsu Plant ： 455-1, Kohzai Minamimachi, Takamatsu, Kagawa, 761-8014 Japan TEL 81-87-882-1131 FAX 81-87-881-5575
Kanonji Plant ： 262 Yoshiokacho, Kanonji, KAGAWA, 768-0021, Japan TEL 81-875-25-5555 FAX 81-875-23-0020
Tokyo Office ： 5F,Shinagawa Grand Central Tower, 2-16-4 Konan,Minato-ku,
Tokyo, 108-0075 Japan		 TEL 81-3-4221-1112 FAX 81-3-4221-1113
Asahimachi Plant ： 3-5-14,Asahimachi,Takamatsu,Kagawa,760-0065 Japan TEL 81-87-851-2002 FAX 81-87-823-6234
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